Advancing Semiconductor Leadership in America Whitepaper

Today, ASIC unveils a whitepaper that details how NIST and the Department of Commerce could establish the National Advanced Packaging Manufacturing Program (NAPMP) as a hub for chip manufacturing. Despite allocating $2.5B to chips in the first year, NIST direction for the NAPMP has been sparse.

Standing up the NAPMP is a critical step towards restoring U.S. leadership in semiconductor design, R&D, and production. This whitepaper proposes a structure for the NAPMP focused on "Coalitions of Excellence," outlines the relationship between a NAPMP and NSTC, and discusses how to involve multiple private and public sector organizations. Read the whitepaper here.