Accelerating Semiconductor Research,
Accelerating America
The American Semiconductor Innovation Coalition (ASIC) represents 200 businesses, startups, universities, national labs, and nonprofits dedicated to bringing the best research and development to The National Semiconductor Technology Center and The National Advanced Packaging Manufacturing Program.
Global Chip Shortage
Semiconductors are part of the backbone of modern life. The ongoing shortage is disrupting supply chains, impacting consumers and businesses, and threatening national security. It exposes the lack of sustained domestic investment in the semiconductor industry and highlights the need for the U.S. to reinvest to guarantee a steady supply of chips and world leadership in chip research and development.
To protect U.S. semiconductor leadership, manufacturing continually fueled by world-leading research and development is key.
The 2021 National Defense Authorization Act’s (NDAA) call to create a National Semiconductor Technology Center (NSTC) and a National Advanced Packaging Manufacturing Program (NAPMP) establishes a pathway for this urgent investment. It will uniquely accelerate the U.S. transformation into a secure semiconductor powerhouse.
ASIC – a broad coalition of businesses, universities, national labs, and nonprofits – has put forward a vision of a technology network, with hubs and geographically distributed centers of excellence, as the main technical driver of the National Semiconductor Technology Center (NSTC) and the National Advanced Packaging Manufacturing Program (NAPMP), supporting the research, development, prototyping, and manufacturing transfer goals of the NSTC and NAPMP and ensuring they are met.
To reach that objective, the technology network must achieve the following:
INNOVATION ECOSYSTEM
Provide an innovation ecosystem for research, development, and prototyping with first-class resources, scientists, facilities, and partners who can work quickly and efficiently.
TECHNICAL AGENDA
Create and execute on an ambitious, but practical, technical agenda focused on the transition from innovation to commercialization.
EXPERIENCED WORKFORCE
Include teams experienced in taking discovery from “lab-to-fab.”
EXPANDED PRIOR INVESTMENT
Expand existing large piloting and prototype integration centers to leverage prior investment and hit the ground running on day one.
IMPROVED INFRASTRUCTURE
Upgrade the infrastructure and programs at key universities, reducing the time for tech transfer and facilitating workforce investment.
START-UP SUPPORT
Facilitate start-ups with access to prototyping facilities provided by the network.
Response to Department of Commerce Request for Information
The American Semiconductor Innovation Coalition (ASIC) with broad representation of industries, small companies, universities, colleges, consortia, and nonprofits, and with technical advice from national labs, offers responses to the Department of Commerce Request for Information 2022-01305. The key principles in the response outline critical aspects to bolster a robust domestic semiconductor supply chain that is achievable, scalable, and sustainable.
Coalition Members Include
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Accenture
Advanced Silicon Group
Advantest
Advent Diamond, Inc.
Ajuba
Akoustis, Inc.
Alphawave
Ambature, Inc.
AMD
Analog Devices
Analog Photonics
Anari AI
ANSYS
Applied Materials
Argonne National Laboratory
Arizona State University
ASE Group
ASM
ASML
ASMPT
ASPDL
AT&S
Atomera
Atomica
Auburn University
Austin Community College
BAE Systems
Battelle Memorial
Blue Cheetah
Boston University
Brewer Science Inc.
BroadPak
BrYet US
Cadence
Cal Poly
Calumet Electronics
Canon Nanotechnologies
Carnegie Mellon University
Caspia
CEA-Leti
Cerfe Labs
City University of New York
Clarkson University
CMC Microsystems
Coherent
Collin’s Aerospace (Raytheon Technologies)
Columbia University
Cornell University
Deca Technologies
DPS
Drexel University
Duke University
DuPont
Edwards Vacuum
eFabless
EMD Digital
Entegris
Evatec AG
Exyte
Fermi National Lab
Finwave Semiconductor
FormFactor
Fraunhofer
Free Form Fibers
Frontier Design Automation
GE Research
Georgia Institute of Technology
Global Foundries
Google
GreenSource Fab
Groq, Incl
Hyperion
IBM
Icahn School of Medicine at Mt. Sinai
imec
Impact Nano
Indium Corp.
iNEMI
Integra Tech
International Microelectronics Assembly and Packaging Society
Intrinsic
IPC
Jabil, Inc.
JSR Micro
Kinetics
KLA Corporation
KPN Technology
Kyocera SLD Laser
Lam Research
Last Mile Education Fund
Linde
Lux Semiconductor
Marvell
Massachusetts Institute of Technology
Materion
Medtronic
Menlo Microsystems
Mercury Systems, Inc.
Metis MicroSystems
Micron Technology
Microsoft
Mosaic Microsystems
Murata Manufacturing Co, Ltd.
Mythic
NanoDX
Nantero
NASA.us LLC
National Institute for Innovation and Technology
NeoLogic
Nepes
NeuReality
New York City Economic Development Corporation
New York State Economic Development Council
New York University
NextFlex
Nhanced Semiconductor
Northrop Grumman
Notre Dame
NOVA
Novarion Systems
North Carolina Agricultural and Technical State University
Nubis Communications
Nvidia
NY CREATES
Ohio State University
Omni Design Tech
Palo Alto Electron
PARC
Partnership For Rhode Island
Pasadena Area Community College
PDF Solutions
Pennsylvania State University
Phase Sensitive Innovations
Phlotonics
Photoronics, Inc.
Polar Semiconductor
Portland State University
Precision Innovations
Princeton Plasma Physics Lab
Princeton University
Promex, Inc.
Purdue University
Qorvo, Inc.
Qualcomm
Rensselaer Polytechnic institute (RPI)
Rochester Institute of Technology (RIT)
Rutgers
Samsung
Sandbox Semiconductor
San Jose State University
Sara Micro Devices
SCREEN Semiconductor Solutions Co., Ltd
Seagate Tech
SEMI
Semiconductor Industry Association
Showa Denko
Siemens-EDA
SiFive, Inc.
Silicon Box
Silicon Catalyst
SiPhox Inc
SkyWater Technology
Spark Photonics Design
Spark Photonics Foundation
SRC
State University of New York
Steel Perlot
Stevens Institute of Technology
SunRay
Synopsys Inc.
Syracuse University
TechSearch International
TechCet
TEL
Teledyne
Terecircuits
TetraMem
Texas A&M
Texas Instruments
Thermo Fisher
Toppan Photomask
TOK
Travera
TTM Technologies, Inc.
ULVAC
Universal Instruments
University of Arizona
University of California, Davis
University of California, Irvine
University of California, Los Angeles
University of California, San Diego
University of Chicago
University of Dayton School of Engineering
University of Florida
University of Illinois at Urbana-Champaign
University of Maryland
University of Massachusetts Amherst
University of Michigan
University of Minnesota
University of Oregon
University of Puerto Rico
University of Rochester
University of Southern California, Viterbi Information Sciences Institute
University of Tennessee, Knoxville
University of Texas
University of Vermont
University of Virginia
University of Wisconsin
Veeco
Ventana Micro Systems
WattsButler LLC
Western Digital
Worcester Polytechnic Institute
Xallent, Inc.
Yield Engineering Systems
Yale University
Yole Development
Zero ASIC
Zestron High Precision Cleaning
3D Glass Solutions